Structural Ceramics
- Structural Ceramics
Aluminum nitride (AlN) substrate. Provided with or without surface metallization.
Industrial structural ceramics are passive (non-electrified) advanced material ceramic components that are used in a variety of applications. Their resistance to wear, thermal stability, and resistance to corrosion make the application of ceramic components an ideal choice for many industrial uses, including thermal or electrical insulators. Fralock provides structural ceramics fabricated with material compositions including alumina, glass, quartz, and aluminum nitride.
Alumina and AlN
Our Alumina and AlN structural ceramics are custom fabricated with high-precision green-to-fire processing systems. In this system we press powders and machine them into shape prior to firing to reduce manufacturing costs. As fired tolerances are greater than hard-grinding, critical surfaces can be stocked, lapped, ground or polished after firing to achieve tight dimensional flatness and surface finish requirements.
- Structural Ceramic Materials
Industrial structural ceramics are passive (non-electrified) advanced material ceramic components that are used in a variety of applications. Their resistance to wear, thermal stability, and resistance to corrosion make the application of ceramic components an ideal choice for many industrial uses, including thermal or electrical insulators. As a structural ceramics manufacturer, Fralock provides structural ceramics fabricated with material compositions including alumina, glass, quartz, and aluminum nitride.
Alumina and AlN
Our Alumina and AlN structural ceramics are custom fabricated with high-precision green-to-fire processing systems. In this system we press powders and machine them into shape prior to firing to reduce manufacturing costs. As fired tolerances are greater than hard-grinding, critical surfaces can be stocked, lapped, ground or polished after firing to achieve tight dimensional flatness and surface finish requirements.
Structural ceramic pins and end effector for semiconductor manufacturing
Fralock’s engineers can assist you in designing, prototyping, and manufacturing the right structural component your application.
Capabilities:
- Alumina diameter up to 31” part size
- Alumina thickness up to 3” (disk shape) or 12” height (cylinder shape)
- AlN sizes up to 15” (381mm) round or square
- AlN thicknesses to 0.800” (20mm)
- Medical device ceramic casings
- Green to Fire Alumina and Green-to-fire tolerances +/- 1.0%
- Hard Grind to tolerances within 0.00002” (0.000508mm)
- Surface metallization available
Materials
Ceramics
- Alumina
- Zirconia
- Aluminum Nitride (AlN)
- Silicon Nitride (SiN)
- Boron Nitride (BN)
- Silicon Carbide (SiC)
- Macor
- Shapel
- Steatite
- Mullite & Cordierite
Glass
- Fused Quartz
- Fused Silica
- Sapphire
- ULE / Zerodure (low CTE glasses)
- Silicon
- BK7 (optical glass)
- Borosilicate
- Germanium
- Zerodur (glass ceramic)
- Additional Glass Available
- Applications
- Fralock Ceramic Materials
FR-995 Ceramic
Features Include:
- High Dielectric Strength
- Metallizable for hermetic assemblies
- High compressive strength
- High volume resistivity
- Enables making complex green machined components
FR-997 Ceramic
Features Include:
- Excellent resistance to hydrofluoric acid attack
- Resistant to Plasma Fluorine ion damage
- Capable of thermal application temperatures up to 1,400°C
- High compressive strength
- No measurable interconnected porosity and a bulk density of >3.91 g/cm3
- High volume resistivity
FR-998 Ceramic
Features Include:
- Excellent resistance to Hydrofluoric, Nitric, and Hydrochloric acids
- Low soda content meets most semiconductor 99.8% Alumina specifications
- Highly resistant to Plasma Fluorine damage
- High volume resistivity and high dielectric strength
FR-AIN-ST Ceramic
Features Include:
- High thermal conductivity of 180 w/mK at 100°C; much higher below room temperature
- Capable of withstanding heating and cooling rates >350°C per second
- Precision green machining available to create complex near net shape components
- Low soda content meets most stringent semiconductor equipment specifications
- Excellent resistance to Fluorine plasma and Hydrofluoric acid
