Encapsulated Interface Solutions
Encapsulated and Laminated Interface Solutions for Semiconductor Equipment
Bringing new performance capabilities to your applications
Protective encapsulation and lamination of materials has proven to be an excellent solution for extending the life of components in semiconductor manufacturing equipment. These materials include those that are used to spread/disperse heat, form a seal, or protect other chamber parts/materials from plasma exposure. There are many types of materials in which a protective coating can greatly enhance performance over that of a single material. Fralock’s adhesiveless lamination provides the ability to layer these materials together in many combinations without the use of adhesives to provide custom engineered solutions that satisfy the stringent requirements of semiconductor manufacturing equipment.
Fralock can assist you in design and fabrication of the appropriate material component to achieve optimal performance of your equipment.
Here we illustrate examples of encapsulated and laminated solutions that have been successfully implemented.
Cross Section
Wafer Manufacturing
Solution Example 1: Teflon Encapsulated Polyimide for Structural Enhancement
Application: Protection against plasma inside the chamber.
Teflon shims are used throughout etch and CVD for applications in protect areas and materials in the chamber. However, Teflon compresses with pressure and heat, causing structural loss of integrity and requiring frequent replacement, increasing the overall cost of operation.
The use of Teflon encapsulated polyimide solves this problem by providing the plasma resistance of Teflon on the outside with the rigidity of a polyimide core on the inside, thus greatly increasing the lifetime of the component. Polyimide materials can be Dupont™ Kapton®, Cirlex®, or other polyimides.
Similar enhanced performance and lifetime is also feasible in wet-process applications when Teflon encapsulated polyimide is used.
Here the Teflon is Encapsulated with Dupont™ Cirlex®. The polyimide is visible inside the colorless Teflon material, which can be seen at the edges.
- Color: White
- Hardness: 98 Shore A
- Electrical: Insulating
- Thermal: Non-thermally conductive
- Temperature Range: Up to 250°C
Solution Example 2: Silicone-Aluminum Foil Lamination for Thermal Spreading
Aluminum is widely used for spreading heat due to its thermal conductivity, low density, and low cost. However, instances arise when a hard metal surface cannot provide adequate contact with the facing component for sufficient heat transfer. In this case, aluminum may be coated with a conductive compressible material to achieve the desired properties. Rubberized silicone is an ideal material for the job, with a high melting point, flexibility, durability, and is safe to handle.
Application:
Any application inside the chamber requiring material that is both electrically and thermally conductive.
The high-power levels used in etch chambers create thermal issues in the showerhead area, especially for dielectric etch. These issues are poor thermal transmission between showerhead and cooling plate, and non-uniform heat distribution across the showerhead.
These processes require a thermal spreader with a compressible material compatible with plasma exposure.
The use of silicone coated foils in the 6 -12 mil range has been highly effective for resolving these issues.
- Thickness: .006”, .009” and .012”
- Color: Black
- Hardness: 93 Shore A
- Electrical: Non-insulating, 102 ohm-m
- Temperature Range: up to 165°C
- Thermal Conductivity: 2.5 W/m-K
Pressure (psi) |
10 |
25 |
50 |
100 |
|---|---|---|---|---|
To-220 Thermal Performance (°C/W) |
2.44 |
1.73 |
1.23 |
1.05 |
Thermal Impedance ( °C-in ²/W) (1) |
0.52 |
0.30 |
0.22 |
0.15 |
Pressure (psi) |
10 |
25 |
50 |
100 |
|---|---|---|---|---|
TO-220 Thermal Performance (°C/W) |
2.44 |
1.73 |
1.23 |
1.05 |
Thermal Impedance ( °C-in ²/W) |
0.52 |
0.30 |
0.22 |
0.15 |
Silicone coated foils are a consumable and should be changed at regular periodic maintenances.
These examples illustrate how Fralock can provide encapsulated and laminated interface material solutions to overcome your thermal management and durability challenges. We can help design the right combination of materials to meet your requirements.
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