Ceramic Heaters
Ceramic Heater Manufacturer
Our Aluminum Nitride ceramic heaters are among the highest performance heaters available in the market today.
Leveraging the powerful coupling of Aluminum Nitride (AlN) ceramic with internal Tungsten resistance heating traces, our multilayer technology allows for complex tungsten circuitry and integrated temperature sensing. Fralock can produce a wide range of heater sizes and shapes to satisfy the demanding requirements of our customers.
We provide engineering support including full internal thermal modeling, CFD, and CAD design services for your thermal management requirements.
The Coefficient of Thermal Conductivity and Linear Expansion are closely matched between AlN and Tungsten, allowing us to engineer ceramic heaters with extremely rapid thermal cycling and precise control.
| Property | Units | Tungsten | AlN |
|---|---|---|---|
|
Linear Coefficient of Expansion per ºC |
ºC |
4.3 x 10E-6 |
4.3 x 10E-6 |
|
Thermal Conductivity (RT) |
W/mK |
170 |
180 |
- ALUMINUM NITRIDE HEATERS FEATURES AND BENEFITS
- Extremely rapid heating in excess of 300°C/sec
- High performance heating combined with micro-channel cooling
- High watt density – 2000W per square inch
- Ultra-rapid temperature transition
- Instantaneous temperature feedback
- Precision temperature uniformity
- Complex tungsten circuitry including multiple zones
- Integrated temperature sensing traces
- All shapes and sizes including tubular heaters
- Sizes range from a few millimeters to 15 inches
- Metallization
AIN ceramic heaters are available in multilayer ceramics or metal laminates of copper or stainless steel.
We can thick or thin film metalize and plate to provide brazeable, solderable, or wire-bondable surfaces.
- Micro Cooling Channels
Internal and External Channels in Aluminum Nitride
The high thermal conductivity and low coefficient of expansion of AlN are employed to carry heat away from electronic devices through internal or external micro cooling channel layers added onto the multilayer circuitry. This can either be used for temperature transition applications or simply to remove heat from devices like laser Diodes, server processors, or power modules.
Rapid cooling is achieved using micro cooling channels
- Thermal Head Cooling Solutions
- Metal coolers brazed or clamped to our Aluminum Nitride heaters
- Integrated cooling channels both internal and external to the heater
- Heater Applications
Semiconductor – Front-end
- Wafer Heaters
- Plasma Generator (dielectric deposition)
Semiconductor – Back-end
- Thermal Compression Bonding
- Class Testing
- Burn-In Testing
- Chip Clock Speed Testing
Aerospace/Defense
- Chip warming in aircraft cameras
Satellite propulsion - High thermal conductivity electrical interposers for drone electronics
- Electrode spacers in high voltage capacitors for high-energy pulse power systems
- Device Under Test thermal testing and class testing for chips used in aerospace applications
Industrial
- Gas chromatographs
- Mass Spectrometry
- Seal Bar Heating
- 3-D Printing
Medical
- Polymerase Chain Reaction (PCR) Heaters – precise and consistent temperature control +/- .25C
- Mass Spectrometry Heater
Cryoablation Heater (for
speeding the thawing process) - Catheter Coater Heaters (for coating wires along a catheter to improve lubricity)
- Tissue Fusion
- Multilayer heaters (with built-in RTDs
- Gas Chromatography, Mass Spectrometry
- Cauterizing/Tissue Ablation
- Tissue Sealing
- Bag Sealing
Other Industries
- Power Modules
- Inverters to change voltages – for small electronics
- IGBT Insulated Gate Bipolar Transducer – high voltage, high current switching
- MOSFET (Metal Oxide semiconductor field effect transfer) – switching devices for automotive electronic control units
Military UAV Camera
Semiconductor Chip Testing
Mass Spectrometry
Tissue Ablation
