Thermal Interface Materials
- Thermal Interface Materials
A thermal interface material (TIM) is a type of material used to improve the thermal conductivity between two surfaces, typically a heat-generating component and a heat sink or cooling device. The primary function of a TIM is to dissipate heat more efficiently and reduce thermal resistance between the two surfaces, which helps prevent overheating of the component.
TIMs are used in electronic devices to help transfer heat away from high-power components, such as computers, energy storage equipment, industrial machinery, medical equipment, semiconductor fabrication equipment, aircraft, spacecraft, and military communications devices, and missile products.
Fralock’s capabilities include designing thermal pads for custom solutions that combine properties such as high thermal conductivity with low electrical conductivity, or specific hardness with resistance to certain chemicals. These products can be engineered with custom materials or layered materials with different properties.
Thermal Management
Interface Materials - Overcoming
Problems in Electronic Systems
- Gap Filler and Graphite-Based Materials
Are commonly used as thermal interface materials (TIMs) in electronic devices to improve the thermal transfer between two surfaces.
Silicone-based and non-silicone-based thermal pads are typically soft, flexible, and easy to apply. They have good conformability, meaning they can fill in gaps and irregularities between two surfaces.
Silicone-based TIMs – these gap filler pads are compressible, electrically insulating and have good resistance to moisture and other environmental factors and have good durability and stability over time. They may contain additional fillers like ceramic or metal particles to enhance their thermal conductivity.
Non-silicone based thermal pads can be composed of various materials such as phase-change, graphite, polymer-based compounds, or ceramics. They offer better thermal conductivity than silicone-based materials and can vary in their electrical conductivity. Some polymers and ceramics are insulating, while others may conduct electricity to some extent. The compressibility and softness of non-silicone pads can vary depending on the material. Longevity and reliability also vary with the material; some can be limited in temperature range or long-term stability. We can provide non-silicone based thermal pad that are right for your unique application.
Graphite-based TIMs – These materials have higher thermal conductivity compared to silicone. They are often used in high-performance applications where efficient heat dissipation is critical. Graphite-based gap pads are typically stiffer and less conformable than silicone-based gap pads. They are also resistant to high temperatures and are suitable for use in high-temperature environments.
Metal Foils – Metal foils can be used as a thermal interface material in certain applications. Metal foils such as copper, aluminum, and their alloys have good thermal conductivity and can be used to improve heat transfer between two surfaces. Metal foils alone can be difficult to handle and apply, and they may require additional measures such as adhesives to ensure proper contact with the surfaces being joined.
Metal Foil-Silicone – Fralock utilizes materials using both metal foil and silicone rubber into one material (Thermal Spreader AS) for both good thermal conductivity and gap filling capabilities.
