Leading the Way in Advanced Materials Solutions

Wafer and Pedestal Heaters

Fralock brings a unique capability to wafer heaters for the semiconductor manufacturing industry.

One of the critical application needs for semiconductor processing in CVD (chemical vapor deposition) is high-temperature processing (450°C to 650°C). The use of aluminum nitride (AlN) for the wafer pedestal is critical for meeting this temperature requirement.

Best Pedestal Heaters
Fralock’s AlN (Aluminum Nitride) ceramic wafer disc and pedestal heaters are made with innovative technology to provide thermal uniformity and enhance thermal cycling, performance, reliability, and precision. Our heaters feature:
  • Multizonal heaters, electrostatic chucks (ESCs), and resistive thermal device sensors (RTDs)
  • Up to 380mm diameter
  • 5 – 10 mm thickness for rapid heat-up and cool-down
  • Active tungsten metal elements in ultra-thin layers
    • Internal ground planes and electrical signal routing
    • Custom electrical stackup
Using multi-layer technology, we can create heaters to specific uniformity and chamber environment needs for high-temperature applications. Internal, metallized layers can be used to create multiple heater zones for precise heating or internal temperature sensors for localized temperature control. By being embedded in the ceramic substrate, this approach provides enhanced thermal transfer to the ceramic body, providing faster temperature ramping capabilities and improved heat distribution.

Several Heating Zones for Effective Thermal Uniformity

Multi-Layer Platen and Pedestal Heaters

Layer Zones

  • Heating elements
  • RTD (resistive thermal device sensors)
  • Ground Signal Transfer
  • Multiple layers create high watt density up to 2,000W/in2
  • Electrostatic chuck

All layers are customizable, depending on your requirements.

Fralock utilizes Gatorizing, a process that increases the bulk resistivity of AlN at elevated temperatures, enhancing ceramic vacuum wafer e-chuck capability and reducing cross-talk between heater and sensor circuitry.

Fralock has patented the ability to create a fully integrated, hermetically-sealed AlN stem-to-platen system. Utilizing this in-plane technology, the electrical connection traces running from the platen through the stem are in the “stem wall”. This allows both electrical connections and the vacuum interface to be positioned at the bottom of the stem, away from the high temperatures of the platen.

Configurations

Our heaters are avaiable in three configurations to fit your needs

Flat Platen Wafer

  • 450oC max operating temperature

Platen with Brazed Stem

  • 450oC max operating temperature
  • Custom Stem Designs hermetically brazed to platen heater

Bonded Stem

  • Co-fired platen and stem
  • 650oC maximum operating temperature
  • Ceramic vacuum groove/wafer chuck configurations available
  • Custom Stem Designs

The distant temperatures are significantly lower than the platen temperatures, thereby extending the life of electrical connections and vacuum interface materials when compared to competitive ceramic technologies.