Interface Solutions

Thermal interface solutions are essential for optimizing heat transfer between electronic components and heat sinks or spreaders, ensuring efficient thermal management in various devices. These components are designed to fill microscopic air gaps and irregularities between surfaces, significantly improving thermal conductivity. By providing reliable and effective heat dissipation, thermal interface solutions help maintain optimal operating temperatures, enhance the performance and longevity of electronic devices, and prevent overheating. Spreading heat with thermal interface materials (TIMs) can improve thermal uniformity in some electronics applications, inhibiting heat buildup in some areas, and creating thermal balance in a system. Thermal dissipation and heat transfer materials are typically graphite, metal, and conductive elastomeric or silicone-based films, or combinations of the these materials. Fralock provides custom engineered thermal interface materials and components to satisfy your specific requirements. Our experienced team of material science specialists will help engineer the right component for your application. Learn about our thermal management solutions.